ARAKAWA CHEMICAL INDUSTRIES, LTD.
Patent Owner
Stats
- 29 US PATENTS IN FORCE
- 3 US APPLICATIONS PENDING
- Feb 15, 2018 most recent publication
Details
- 29 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 518 Total Citation Count
- Mar 10, 1987 Earliest Filing
- 35 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2018/0043,667 EMULSION COMPOSITION AND PRODUCTION METHOD THEREOF, AND LAMINATE AND PRODUCTION METHOD THEREOFSep 01, 16Feb 15, 18[B05D, C08F, B29C, B32B]
2016/0257,852 METHOD FOR MANUFACTURING LIGHT-COLORED REFINED TALL OIL ROSIN AND TALL OIL ROSIN ESTER, AND LIGHT-COLORED REFINED TALL OIL ROSIN AND TALL OIL ROSIN ESTER OBTAINED VIA SAID METHODOct 27, 14Sep 08, 16[C09F]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9758703 Tackifier, tackifier for medical or industrial use, adhesive and/or pressure-sensitive adhesive for medical or industrial use, adhesive sheet and/or pressure-sensitive adhesive sheet for medical or industrial use, and pressure-sensitive adhesive tape for medical or industrial useJan 25, 13Sep 12, 17[C09J, A61L, C08K]
9670382 Base film and pressure-sensitive adhesive sheet provided therewithMar 22, 12Jun 06, 17[C09J, H01L, C08G, B32B]
9559073 Base film and pressure-sensitive adhesive sheet provided therewithMar 22, 12Jan 31, 17[C09J, H01L]
9346993 Heat dissipating coating composition and heat dissipating coating filmMar 02, 13May 24, 16[C09K, C09D, C08L, C08K]
8877697 Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder fluxAug 20, 10Nov 04, 14[C23G, C11D, H05K]
8829077 Easily thermally decomposable binder resin, binder resin composition and use of said compositionJan 19, 11Sep 09, 14[C09J, C04B, C08L, C08K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2015/0075,676 BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTEAbandonedMay 13, 13Mar 19, 15[B23K]
2014/0014,521 FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedSep 17, 13Jan 16, 14[H05K]
2013/0065,990 ROSIN-MODIFIED PHENOLIC RESIN, PROCESS FOR PRODUCTION THEREOF, VARNISH FOR PRINTING INK, AND PRINTING INKAbandonedMay 19, 10Mar 14, 13[C08G, C09D]
2012/0225,969 URETHANE (METH) ACRYLATE AND PRODUCTION METHOD THEREOF, CROSS-LINKED URETHANE (METH) ACRYLATE AND PRODUCTION METHOD THEREOF, AND LIGHT CURABLE AQUEOUS EMULSIONAbandonedDec 27, 11Sep 06, 12[C08G]
2012/0216,840 ELECTRONIC COMPONENT CLEANING DEVICE AND CLEANING METHODAbandonedOct 21, 10Aug 30, 12[B08B]
2012/0037,405 FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedMay 24, 10Feb 16, 12[H05K]
2012/0010,358 ROSIN-MODIFIED PHENOL RESIN, MANUFACTURING METHOD THEREOF, AND PRINTING INKAbandonedFeb 17, 10Jan 12, 12[C08G, C09D]
2011/0288,208 MODIFIER FOR RESINS, ADHESIVE COMPOSITIONS, AND THERMOPLASTIC RESIN COMPOSITIONSAbandonedMar 11, 10Nov 24, 11[C09J, C09F]
2011/0244,326 ELECTRODE FOR SECONDARY BATTERY AND MANUFACTURING PROCESS FOR THE SAMEAbandonedJul 14, 08Oct 06, 11[H01M]
2009/0286,015 Curable resin composition, cured product thereof, and various articles derived from thoseAbandonedJul 19, 06Nov 19, 09[C09K, C08L, B32B]
2009/0042,762 CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUXAbandonedMar 16, 07Feb 12, 09[C11D]
6458902 Process for producing hydrogenated C9 petroleum resin and hydrogenated C9 petroleum resin obtained by the processExpiredMay 08, 00Oct 01, 02[C08F]
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